Packaging Engineer jobs in Maryland

This position is responsible for developing optoelectronic packaging for advanced photonic components, including semiconductor lasers and photonic integrated circuits. Extensive experience with advanced photonic components and the ability to do the related optical and mechanical design is expected, as well as the proven ability to bring optoelectronic products into production. This role collaborates actively with semiconductor chip designers, process engineers and test engineers to design, develop, and manufacture photonic components from proof-of-concept prototypes all the way through final design documentation and product qualification.

Essential Job Functions include the following, but are not limited to:

• Design and develop optoelectronic packaging for semiconductor lasers and related devices using strong multi-disciplinary engineering skills and knowledge
• Mechanical
• Optical
• Materials
• Design new products taking advantage of existing packaging processes and manufacturing infrastructure
• Create new packaging processes and manufacturing infrastructure
• Document designs, analysis, and test results in engineering reports
• Support root-cause-analysis and yield improvement for existing manufacturing processes
• Support training and creation of work instructions for new manufacturing processes

The Company retains the right to change or assign other duties to this position

The employee must have the ability to work in a clean-room environment with compressed gases, lasers and use personal protective equipment such as safety glasses, masks, and gloves. The noise level in the work environment is usually moderate.